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Home > Tools / Accessories > GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)

GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)

$40.00 $0.00
Formulated with a specialized silicone base, this product features low viscosity and excellent penetration capabilities.
It maintains a long working time after mixing components A and B.
Once fully cured, it achieves a thermal conductivity of 3.2 W/m·K.
GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)
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  • GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)
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  • GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)
  • GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)
  • Description
GN7053 High Thermal Conductivity Potting Compound (3.2 W/m·K)

Formulated with a specialized silicone base, this product features low viscosity and excellent penetration capabilities.
It maintains a long working time after mixing components A and B.
Once fully cured, it achieves a thermal conductivity of 3.2 W/m·K.
Applications: Temperature sensors, motor potting, high-temperature modules, and thermally conductive soft sealants.
1 Unit = 1 kg (Component A: 500 g + Component B: 500 g)
Detailed Specifications:
Mixing Ratio: 1:1
Working Time: 40 minutes (at 25°C)
Curing Time: 24 hours (at 25°C)
Dielectric Loss (1 MHz): 2.1 × 10⁻³
Dielectric Strength: 18 kV/mm
Thermal Conductivity: 3.25 W/(m·K)
Flame Retardancy: V-0








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