Made of stainless steel and aluminum alloy, high temperature resistance, no deformation, precise positioning. Suitable for ASIC chip: BM2280AA Extra 20000pcs BGA solder balls The project consists of a chip holder and 2 steel mesh covers. When using, use one of the steel mesh covers to evenly apply solder paste on the chip solder joints, Then use another steel mesh cover to shake the BGA solder balls into the chip solder joints, Finally, heat with a hot air gun until the solder balls melt.
