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3D infrared thermal imaging PCB repair

$598.00 $0.00
Professional PCB circuit board detector, infrared imaging analysis heat source point, quickly locate the fault point.
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  • Description
3D infrared thermal imaging PCB repair

Professional PCB circuit board detector, infrared imaging analysis heat source point, quickly locate the fault point.
When servicing hash board, Miner power supplies and control board, it is sometimes impossible to directly determine the exact location of the damaged parts. Therefore, we can use the principle of thermal imaging to quickly find parts with abnormal heating.

Not only that, the device also supports advanced measurement modes such as 3D mode and comparative measurement, which is convenient for you to quickly and accurately locate the fault point.
Supporting software can be set in English.

key parameter:
Resolution 52000 points
Input vo DC 5V
Temperature measurement range -20℃ - 120℃
Storage temperature -15℃ - 60℃
Connector type Type-C   USB
Bracket size 150mm*160mm*162mm
Package dimensions 180mm*180mm*59mm
Visual media All kinds of LED displays






Appearance:






Manual focus ring for fast and precise focusing.


Up to 52,000 points of temperature measurement, covering a larger area of the PCB circuit board, and more accurate temperature identification.


Appearance and Packaging


Function brief description:
One-click leakage quick query, quickly locate the fault point of the motherboard.


Conventional temperature extraction and identification:



One-click quick query:



High temperature alarm tracking, real-time monitoring of temperature changes.
When the temperature exceeds the set temperature, the image flashes a red frame and prompts an alarm.
This feature can be used to track the maximum temperature on the screen and identify the temperature.




Added 2D/3D thermal field distribution function,
The innovative 3D thermal field mode can more intuitively understand the PCB temperature state,
2D thermal field area curve recording is more detailed.

Rotating 3D, thermal field analysis in more dimensions:





2D thermal field pattern curve record, accurate time dimension data:


Double PCB board comparison, regional temperature, curve comparison record.
It is used for thermal distribution design optimization, fault differentiation comparison and verification, regional temperature curve comparison record, and superposition comparison.

Place the two PCB boards on both sides of the dividing line for comparative analysis under the same conditions:




Regional dotted line merge analysis and comparison,
Regional curve independent analysis and comparison:




A variety of color modes, you can switch different color palettes according to different scenes:



The supporting software has multiple modes, corresponding to different usage scenarios:
Maintenance, evaluation, R&D... Wide range of applications.


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