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Name: PCB self drying photosensitive ink
Brand: THANOS MINING
Price: 17 USD
Availability: InStock

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PCB self drying photosensitive ink

$17.00

Name: Self-drying photosensitive anti-etching ink
Packing: 1KG or 5KG
State: liquid
color: blue
Viscosity: 70ps±10ps (25℃)
Non-volatile matter: 70%
Function: metal anti-etching, anti-plating

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Description

Tips:
Due to DHL, UPS, FedEx express company's restrictions on the types of items shipped, liquid and paste products cannot be shipped by DHL, UPS, FedEx, they will be delivered by other special shipping methods alone, and the delivery time is about 15- 40 days. For other requirements, please contact the pre-sales service via WhatsApp.

PCB self drying photosensitive ink

The main technical parameters

Name: Self-drying photosensitive anti-etching ink
Packing: 1KG or 5KG
State: liquid
color: blue
Viscosity: 70ps±10ps (25℃)
Non-volatile matter: 70%
Function: metal anti-etching, anti-plating

Features
Self-drying liquid photoresist ink. It has excellent photosensitivity and corrosion resistance. The outstanding feature is that after screen printing or spraying, it can be completely dried at room temperature (30-35℃) for more than 1 hour. The second-side printing or photosensitive, developing and etching can be performed without baking, which greatly facilitates the user.

[Process] Screen printing or double-sided spraying >> Natural drying (room temperature 35 degrees, about 2 h / dark) >> Printing the second side >> Natural drying >> Exposure >> Development (2‰ sodium carbonate aqueous solution) >> Etching (acid chemical etching or electro-etching) or electroplating >> Decoating (5% sodium hydroxide).

【Features】Liquid photoresist ink is widely used in the etching of precision metal patterns. It has high resolution and strong corrosion resistance, but the photoresist inks currently on the market all need to be pre-dried in a thermal cycle oven at 70-90°C for 30-50min, and the surface can be dried before photosensitive and developing. For double-sided boards, the following troubles are often encountered when baking twice:
(1) Baking does not dry, resulting in sticking to the negative film;
(2) Excessive baking, no exposure or difficulty in developing;
(3) The baking time on both sides of the double-sided board is different, resulting in inconsistent photosensitive and developing conditions;
(4) The photosensitive layer on the large-sized metal plate cannot be dried. For enterprises with poor equipment conditions or no blasting in the oven, there are more problems and lower yields.
It is suitable for the etching resistance of high-precision printed circuit boards and the etching of stainless steel, copper, aluminum and white iron.

Instructions for use
1. Printing:
Use 40T mesh (100 mesh) printing, nickel-plated gold can use 100T wire mesh; metal spraying operation.
2. Exposure
1. Test the exposure ruler: place the exposure ruler on the surface of the ink, and conduct an exposure test. After developing, the exposure ruler grid number is 7-9 grids (using a 21-level exposure ruler) cover film to determine the setting of the exposure machine energy index.
2. Observe whether there is sticky film phenomenon.
3. Development
1. The temperature of the developer (Na2CO3 or K2CO3) is 30±2℃, the concentration is 1±0.2%, and the spray pressure is 2±0.5kg/cm2
2. Observe whether there is oil loss, thin lines, sand holes, unclean development, etc.
4. Etching
1. The pH of the etching solution is ≤9.5, the spray pressure is 2.5 kg/cm2, and the temperature is 60±5℃.
2. If the etching depth (thickness) is within 0.2mm, there is no need to post-bake after development. For products with etching depth (thickness) exceeding 0.2mm, please bake at 150℃ for 20 minutes at high temperature after development to enhance the adhesion of the ink. etching effect.

5. Removal of film
Automatic film removal: NaOH concentration 5-8%, liquid temperature 55±5℃, spray pressure 2±0.5kg/cm2.
Manual film removal: NaOH concentration 5-8%, soak in liquid temperature 55±5℃, rinse with tap water.

Techniques that should be mastered in the use of photosensitive circuit inks
Screen printing process
Generally, the thickness of silk screen printing on the substrate is 20um-25um, and the thickness after post-baking is 10um-15um.

pre-bake
It is to initially evaporate the solvent in the ink, so that the negative film does not stick to the subsequent exposure. That is, the pre-baking temperature is 75°C-80°C, and the time is 15-20 minutes.

Exposure process
After the ink is pre-baked, the polymerization and cross-linking reaction occurs under the irradiation of ultraviolet light, so that it will not be washed out during development.
Generally, the exposure scale of liquid photosensitive circuit ink is required to be 7-9 grids (21 grid exposure scales). Try to increase the exposure energy to the upper limit without developing uncleanness.
The light transmittance of the negative film: it needs to be disabled after the number of exposures of the negative film reaches 300-500 times.
Exposure lamp: Under normal circumstances, the exposure lamp used by the 7kw exposure machine can be used for 1000 hours.
The exposure lamp and cooling quartz tube core must be kept clean. Do not touch it directly when replacing.
Development process
Development is to wash away the unreacted (shading part of the film) ink with a developing solution (NaCO3 or K2CO3), leaving the photopolymerized part (the light-transmitting part of the film).

Precautions:
The developer temperature is generally controlled between 28-32 °C;
The developer concentration is generally controlled between 0.8%-1.2%;
The developing pressure is generally controlled at 1.0-3kg\C㎡
The development time is generally controlled to 20-30 seconds.
Post-baking process
(In order to obtain a cured epoxy resin product with excellent performance, it is very important to perform post-curing at high temperature. Post-baking makes all functional groups participate in the reaction, thereby increasing the crosslinking density. The properties of the resin cured product are very favorable). Post-baking makes the resin in the ink polymerize and cross-link completely, so that the ink layer reaches a certain hardness. The temperature is generally controlled at 150°C-155°C, and the time is 8-10 minutes. Excessive post-baking can make the ink brittle.

before use:
1. The ink should be fully stirred evenly.
2. This series of ink needs to be diluted, please contact our company, our company will provide special thinner.
3. This information is the result of the company's experiments and is for reference only. The customer needs to carry out the confirmation experiment before setting the appropriate conditions of use.
4. Do not add 783 to boil oil and water to boil oil. If you want to boil oil and water, use 414 anti-white water or our company's special boiled oil and water.
5. The product is stored in a dark (no white light) place with a temperature of 22±2℃ and a humidity of 55±5RH.
6. The lighting of the workplace should be yellow light, and avoid sunlight and fluorescent lamps.
7. When using this ink, if it touches the skin, please wash it with soap.
The workplace must be kept clean, and pollution will cause poor quality and trouble.
8. The ink contains solvent, the workshop should be well ventilated, the temperature is 22±2℃, and the humidity is 55±5%RH.

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PCB self drying photosensitive ink

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