Applicable models: Cell phones, hash boards, precision circuit boards, tin plating during repairs, and BGA rework. 138℃ solder paste is suitable for shielding covers and tin plating of heat sinks. 183℃ solder paste is suitable for tin plating of CPU, GPU, main control chip, etc. 217℃ solder paste is suitable for parts with higher strength requirements, such as spring copper pins, contact point copper sheets, etc. Please choose the appropriate product according to different welding needs. Features: The solder joints are white and full, with no false soldering or false soldering. Moreover, they have a strong recombination force with the soldering iron, and the tin spots are bright and full, eliminating false soldering.
