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  • ASIC chip aging repair agent
  • ASIC chip aging repair agent
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  • ASIC chip aging repair agent
  • ASIC chip aging repair agent
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ASIC chip aging repair agent 50ml

$15.00 $0.00
Content: 50ml
After the product is upgraded, the price remains unchanged and the capacity is larger.
The surface of the repaired ASIC can be better attached to the solder, and the tin plating effect is excellent, which is convenient for the welding of the heat sink.
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  • Description
ASIC chip aging repair agent

This product is an enhanced ASIC surface repair agent developed by THANOSMINING after many times of debugging, proportioning and practical application improvement. It is an active repair formulation developed specifically for the backside properties of the BM1396 and BM1397 series ASICs. Of course, it is also suitable for backside repair tinning of similarly packaged ASIC chips.
It is suitable for the repair work of Antminer S17, T17 series ASIC chip resoldering heat sink. It can perfectly restore the solder joint surface on the back of the chip, making the tinning work easier, covering a large area and easy to dissipate heat.
guide:
1: Clean the tin surface on the back of the ASIC chip and apply the repair solution to the back of the ASIC.
2: Adjust the temperature of the electric soldering iron to about 380°, and apply tin with solder wire.

Content: 50ml
Antminer S17 series and T17 series, the original heat sink is connected with solder and ASIC chip. After long-term operation and temperature difference changes, it is easy to cause the surface of the ASIC chip to age, causing the heat sink to fall off, thereby affecting the heat dissipation and causing the ASIC chip to fail.
After the surface of the ASIC chip is aged, it is difficult to tin and paste the heat sink, so we use a repair agent to repair the aged surface and stains.
The repaired chip surface has excellent tin plating performance.

Tips:
As the product is liquid, the international transportation management is strict, for the smooth delivery of the product, THANOSMINING reserves the right to change the shape of the outer packaging and container according to the requirements of the courier company, without prior notice to customers about this process.
When using, just apply it on the back of the ASIC chip (the part that needs to be tinned), do not directly touch the PCB circuit board to avoid damage.







It is difficult to tin the surface of the chip that has been aged and turned black. The ASIC chip can be easily damaged if it is forcibly polished：





The surface of the repaired ASIC can be better attached to the solder, and the tin plating effect is excellent, which is convenient for the welding of the heat sink.

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